Basic Info.
Copper Thickness
2/2/2/2 Oz
Specification
UL, ROHS, ISO9001, 94v0
Product Description
FZ-PCB Technology Co., ltd
------PCB production, PCB assembly service provider
As a technical manufacturer specializing in the printed circuit board& pcb assembly industry, Whether you need rigid pcb circuit boards, flexible PCB(FPC), rigid flex pcb circuits or aluminum clad pcb circuit boards, FZ-PCB's manufacturing solutions can help.
Rigid PCB from Single-sided up to 16 layers (thickness 0.4mm Min., 3.2mm Max)
Flex/Flex-rigid pcb (up to 12 layers)
HF/Impedance-control (Polar)
HDI, Halogen-free pcb circuit boards
Copper up to 6 oz
RoHS/UL, ISO9001: 2000 & ISO/TS16949: 2002
IPC 6010, IPC6012, IPC6013 Class 1-3
FZ-PCB Company Profile
· Established in 2002
· Privately owned company
· 10, 700 Square feet Facility
· Nearly 600 Employees
· 21, 000 Square feet Monthly output
· Specialize in Prototypes to large batch production
· High technology multilayer PCBs
· HDI and Sequential Lamination
· Flexible, Flex-rigid and Rigid PCBs
· Turnover USD$16 Million (2012-2013)
· RoHS/UL, ISO9001: 2000 & ISO/TS16949: 2002
What will you get from FZ-PCB
· Reliable and stable quality with more than 12 years pcb manufacturing experience.
· Quick response & 24 hours available service.
· Professional sales service & advice.
· Fulfillment of our promises, NO lies.
· Protecting your Intellectual property. All our staff of trained professionals are · Working under a strict confidential contract.
PCBA Capabilities included:
· Components procerement, PCB and accessories manufacturing, PCB Assembly, mechanical and final assembly, Electronic testing and function testing.
· High precision0402, 0603, 0805, 1210 and 2512; Fine pitch QFP(0.3mm), BGA(0.5mm), IC(0.3mm) bonding size components SMT technology and lead free RoHS technology.
· Circuit boards with 1 to 8 layers PCB layout, modification, fabrication, plastics, metal box building, final assembly and testing.
· ISO 9001-2000 certification and elevator safety report.
PCBA building experience range
· Industrial elevator system, digital video record (DVR) system, medical, computing, storage, instrumentation, traffic, industrial power, fire alarm, wireless communication, telecommunication, networking and house controller.
· Stencil size/range: 736*736mm
· Minimum IC pitch: 0.3mm (12mil)
· Foot Pin: SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
· Maximum PCB size: 410x600mm(16.2''*23.6'')
· Minimum PCB thickness: 0.35mm(13.8mil)
· Minimum chip size: 0201 (0.2x0.1mm)/0603 (0.6 x 0.3mm)
· Maximum BGA size: 74x74mm (2.9''*2.9'')
· BGA ball pitch: 1mm ~3mm (4mil~12mil)
· BGA ball diameter: 0.4mm~1mm (16mil~40mil)
· QFP lead pitch: 0.38mm ~ 2.54mm (15mil~100mil)
· Frequency of stencil cleaning: 1 time/5 to 10 pieces
· Package: Anti-static Bubble bag& Carton
Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
After-Service:
1. All our products have been checked and packaged in good condition.
2. If the items you received is defective, please contact us asap.
We will replace another new one after we check it
Payment method
1. T/T
2. Paypal
3. Western Union
Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide. |
Layer No. | 1 - 16 Layers |
Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
Board Thickness Tolerance | ±10% |
Copper thickness | 0.3OZ - 4OZ |
Impedance Control | ±10% |
Warp and Twist | ≤0.075% |
Peel Strength | ≥61B/in(≥107g/mm) |
Min Trace Width (a) | 3mil |
Min Space Width (b) | 3mil |
Min Annular Ring | 0.004"(0.1mm) |
SMD Pitch (a) | 0.012"(0.3mm) |
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
Register tolerance | 0.05mm |
Min Solder Mask Dam (a) | 0.005"(0.125mm) |
Solder mask Clearance (b) | 0.005"(0.125mm) |
Min SMT Pad spacing (c) | 0.004"(0.1mm) |
Solder Mask Thickness | 0.0007"(0.018mm) |
Hole size | 0.008"(0.20mm)-- 0.257"(6.5mm) |
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
Max PTH Aspect Ratio | 10:1 |
Hole Registration | 0.003"(0.075mm) |
HASL | 2.5um |
Lead free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au:1-3u'' |
OSP | 0.2-0.5um |
Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
Beveling | 30°45° |
V-cut | 15° 30° 45° 60° |
Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
Certificate | ROHS ISO9001 TS16949 SGS UL |
Special requirements | Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger |
Address:
Room 1102, Jianjunyuan Building 3, Caitian North Road, Shangmeiin, Futian District, Guangdong Province, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Auto, Motorcycle Parts & Accessories, Computer Products, Consumer Electronics, Electrical & Electronics, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Manufacturing & Processing Machinery, Security & Protection
Management System Certification:
ISO 9001, ISO 14001, IATF16949
Company Introduction:
FZ-PCB is one of Asia′ S leading full-service PCB to PCBA solution providers. Established in the year 2002, mainly provide the high-level quality PCB board and PCB assembly service to our customer which are the leading companies in the telecommunication, LED, medical treatment, aviation, instrumentation, micro-electronics and automated-control area. Our achievements are recognized through our customers′ Success, industry and customer recognition, and continuous quality improvement.