High-Temperature Fr4 Tg180 PCB Board

As a technical manufacturer specializing in the printed circuit board& pcb assembly industry,Whether you need rigid pcb circuit boards, flexible PCB(FPC), rigid flex pcb circuits or aluminum clad pcb circuit boards, FZ PCB's manufacturing solutions can help.


Rigid PCB from Single-sided up to 16 layers (thickness 0.4mm Min., 3.2mm Max)
Flex/Flex-rigid pcb (up to 12 layers)

HF/Impedance-control (Polar)
HDI, Halogen-free pcb circuit boards
Copper up to 6 oz
RoHS/UL, ISO9001:2000 & ISO/TS16949:2002
IPC 6010,IPC6012,IPC6013 Class 1-3


100% E-test For PCB Board:
---We perform multiple quality assuring procedures before shipping out any PCB board. These include:
1) Visual Inspection
2) Flying probe
3) Impedance control
4) Solder-ability detection
5) Digital metallographic microscope
6) AOI (Automated Optical Inspection)

What will you get from FZ-PCB

·Reliable and stable quality with more than 12 years pcb manufacturing   experience.
·Quick response & 24 hours available service.
·Professional sales service & advice.
·Fulfillment of our promises, NO lies.
·Protecting your Intellectual property. All our staff of trained professionals are ·working under a strict confidential contract.


Delivery Timescales

Sample

·Single layer               5 days
·Double Side              5-7days
·4 ~ 6 layers               8-10days
·Above 8 layers         10-14days
·Aluminum PCB         7-10days
·Flexible PCB              10-14days
* Urgent Routing sample could be pushed 2-3 days earlier with premium.

Mass Production

·Single layer                  standard 10 days
@Double Side                 standard 13days
·4~6 layers                    standard 15days
·above 8 layers            standard 18days
·Aluminum PCB            standard 15days
·Flexible PCB                standard 18days
* Material availability dependant.


Factory galance



Package & Shipping Method:

1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

Payment method

1.     T/T
2.     Paypal
3.     Western Union



Files
Gerber, Protel, Powerpcb, Autocad, Orcad, etc
Material
FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide.
Layer No.
1 - 16 Layers
Board thickness
0.0075"(0.2mm)-0.125"(3.2mm)
Board Thickness Tolerance
±10%
Copper thickness
0.3OZ - 4OZ
Impedance Control
±10%
Warp and Twist
≤0.075%
Peel Strength
≥61B/in(≥107g/mm)
Min Trace Width (a)
3mil
Min Space Width (b)
3mil
Min Annular Ring
0.004"(0.1mm)
SMD Pitch (a)
0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)
0.027"(0.675mm)
Register tolerance
0.05mm
Min Solder Mask Dam (a)
0.005"(0.125mm)
Solder mask Clearance (b)
0.005"(0.125mm)
Min SMT Pad spacing (c)
0.004"(0.1mm)
Solder Mask Thickness
0.0007"(0.018mm)
Hole size
0.008"(0.20mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)
±0.003"(±0.0762mm)
Max PTH Aspect Ratio
10:1
Hole Registration
0.003"(0.075mm)
HASL
2.5um
Lead free HASL
2.5um
Immersion Gold
Nickel  3-7um  Au:1-3u''
OSP
0.2-0.5um
Panel Outline Tol (+/-)
±0.004''(±0.1mm)
Beveling
30°45°
V-cut
15° 30° 45° 60°
Surface finish
HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate
ROHS  ISO9001 TS16949  SGS  UL
Special requirements
Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger