High Quality PCB Board and Circuit Board
| US$0.10 | 1 piece (MOQ) |
Production Capacity:
62500sqm /Month
Transport Package:
Vacuum Packing, Carton Box
Payment Terms:
T/T, Paypal, Western Union
FZ-PCB TECHNOLOGY CO., LIMITED
Guangdong, China
Last Login Date:
Apr 10, 2017
Main Products:
PCB, PCBA, Single Side PCB, Double Side PCB, Multilayer PCB, Aluminum PCB, PCB Assembly, Metal PCB, Fr4 PCB, Cem-1 PCB
Product Description
Company Info
Basic Info.
Model NO.
pcb, pcbs, pcb board, circuit board
Type
Rigid Circuit Board
Dielectric
FR-4
Material
Fiberglass Epoxy
Application
Flame Retardant Properties
V0
Mechanical Rigid
Processing Technology
Electrolytic Foil
Base Material
Insulation Materials
Epoxy Resin
Surface Finish
Enig, Immersion Silver, HASL, OSP, Gold Finger
Special Process
Epoxy Resin, Laser Drill, Blind/Bury Holes
Board Thickness
0.2~3.2mm
Trademark
fzpcb
Specification
UL, ROHS, ISO9001, 94v0
Origin
Shenzhen, China
HS Code
8534009000
Product Description
High technology 1~16layers PCBs from 0.2~3.2mm thickness with 0.3~4.0oz copper thickness
FR4, FR4(TG130, 150, 170), FR1, CEM-1, CEM3, Aluminum based, HF (Rogers, Teflon)
HDI and Sequential Lamination
Flexible, Flex-rigid and Rigid PCBs
RoHS/UL, ISO9001: 2008 & ISO/TS16949: 2009, ISO14001:2004
Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
Payment method
1. T/T
2. Paypal
3. Western Union
FR4, FR4(TG130, 150, 170), FR1, CEM-1, CEM3, Aluminum based, HF (Rogers, Teflon)
HDI and Sequential Lamination
Flexible, Flex-rigid and Rigid PCBs
RoHS/UL, ISO9001: 2008 & ISO/TS16949: 2009, ISO14001:2004
Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
Payment method
1. T/T
2. Paypal
3. Western Union
| Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
| Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide. |
| Layer No. | 1 - 16 Layers |
| Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
| Board Thickness Tolerance | ±10% |
| Copper thickness | 0.3OZ - 6OZ |
| Impedance Control | ±10% |
| Warp and Twist | ≤0.075% |
| Peel Strength | ≥61B/in(≥107g/mm) |
| Min Trace Width (a) | 3mil |
| Min Space Width (b) | 3mil |
| Min Annular Ring | 0.004"(0.1mm) |
| SMD Pitch (a) | 0.012"(0.3mm) |
| pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
| Register tolerance | 0.05mm |
| Min Solder Mask Dam (a) | 0.005"(0.125mm) |
| Solder mask Clearance (b) | 0.005"(0.125mm) |
| Min SMT Pad spacing (c) | 0.004"(0.1mm) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Hole size | 0.008"(0.20mm)-- 0.257"(6.5mm) |
| Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
| Max PTH Aspect Ratio | 10:1 |
| Hole Registration | 0.003"(0.075mm) |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-3u'' |
| OSP | 0.2-0.5um |
| Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
| Beveling | 30°45° |
| V-cut | 15° 30° 45° 60° |
| Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
| Certificate | ROHS ISO9001 TS16949 SGS UL |
| Special requirements | Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger |
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