One Stop LED PCB to LED PCB Assembly
| US$0.10 | 1 piece (MOQ) |
Production Capacity:
62500sqm /Month
Transport Package:
Vacuum Packing, Carton Box
Payment Terms:
T/T, Paypal, Western Union
FZ-PCB TECHNOLOGY CO., LIMITED
Guangdong, China
Last Login Date:
Apr 10, 2017
Business Type:
Manufacturer/Factory
Main Products:
PCB, PCBA, Single Side PCB, Double Side PCB, Multilayer PCB, Aluminum PCB, PCB Assembly, Metal PCB, Fr4 PCB, Cem-1 PCB
Product Description
Company Info
Basic Info.
Model NO.
led pcb, pcb, aluminum led
Metal Coating
Silver
Mode of Production
SMT
Layers
Single-Layer
Base Material
CEM-1
Certification
RoHS, CCC, ISO
Customized
Customized
Condition
New
Board Thickness
0.2~3.2mm
Trademark
fzpcb
Specification
UL, ROHS, ISO9001, 94v0
Origin
Shenzhen, China
HS Code
8534009000
Product Description
Specialize in Aluminum LED PCB with competitive price in LED PCB line
High technology Singel and double side LED PCBs, 0.2~3.2mm thickness with 0.3~4.0oz copper thickness
FR4, FR4(TG130, 150, 170), FR1, CEM-1, CEM3, Aluminum based, HF (Rogers, Teflon)
RoHS/UL, ISO9001: 2008 & ISO/TS16949: 2009, ISO14001: 2004
Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
Payment method
1. T/T
2. Paypal
3. Western Union
High technology Singel and double side LED PCBs, 0.2~3.2mm thickness with 0.3~4.0oz copper thickness
FR4, FR4(TG130, 150, 170), FR1, CEM-1, CEM3, Aluminum based, HF (Rogers, Teflon)
RoHS/UL, ISO9001: 2008 & ISO/TS16949: 2009, ISO14001: 2004
Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
Payment method
1. T/T
2. Paypal
3. Western Union
| Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
| Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide. |
| Layer No. | 1 - 16 Layers |
| Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
| Board Thickness Tolerance | ±10% |
| Copper thickness | 0.3OZ - 4OZ |
| Impedance Control | ±10% |
| Warp and Twist | ≤0.075% |
| Peel Strength | ≥61B/in(≥107g/mm) |
| Min Trace Width (a) | 3mil |
| Min Space Width (b) | 3mil |
| Min Annular Ring | 0.004"(0.1mm) |
| SMD Pitch (a) | 0.012"(0.3mm) |
| pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
| Register tolerance | 0.05mm |
| Min Solder Mask Dam (a) | 0.005"(0.125mm) |
| Solder mask Clearance (b) | 0.005"(0.125mm) |
| Min SMT Pad spacing (c) | 0.004"(0.1mm) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Hole size | 0.008"(0.20mm)-- 0.257"(6.5mm) |
| Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
| Max PTH Aspect Ratio | 10:1 |
| Hole Registration | 0.003"(0.075mm) |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-3u'' |
| OSP | 0.2-0.5um |
| Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
| Beveling | 30°45° |
| V-cut | 15° 30° 45° 60° |
| Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
| Certificate | ROHS ISO9001 TS16949 SGS UL |
| Special requirements | Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger |
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