Lead Free Assembly PCB Assembly

High technology 1~16layers PCBs from 0.2~3.2mm thickness with 0.3~4.0oz copper thickness
FR4, FR4(TG130,150,170), FR1,CEM-1, CEM3, Aluminum based, HF (Rogers,Teflon)
HDI and Sequential Lamination
Flexible, Flex-rigid and Rigid PCBs
RoHS/UL, ISO9001:2008 & ISO/TS16949:2009, ISO:14001:2004

Market Segment

Factory glance

PCBA Capabilities included
*Components procerement, PCB and accessories manufacturing, PCB Assembly, mechanical and final assembly, Electronic testing and function testing.
*High precision0402, 0603, 0805, 1210 and 2512; fine pitch QFP(0.3mm), BGA(0.5mm), IC(0.3mm) bonding size components SMT technology and lead free RoHS technology.
*Circuit boards with 1 to 8 layers PCB layout, modification, fabrication, plastics, metal box building, final assembly and testing.
*ISO 9001-2000 certification and elevator safety report.

Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

Payment method
1.     T/T
2.     Paypal
3.     Western Union

Files
Gerber, Protel, Powerpcb, Autocad, Orcad, etc
Material
FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide.
Layer No.
1 - 16 Layers
Board thickness
0.0075"(0.2mm)-0.125"(3.2mm)
Board Thickness Tolerance
±10%
Copper thickness
0.3OZ - 4OZ
Impedance Control
±10%
Warp and Twist
≤0.075%
Peel Strength
≥61B/in(≥107g/mm)
Min Trace Width (a)
3mil
Min Space Width (b)
3mil
Min Annular Ring
0.004"(0.1mm)
SMD Pitch (a)
0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)
0.027"(0.675mm)
Register tolerance
0.05mm
Min Solder Mask Dam (a)
0.005"(0.125mm)
Solder mask Clearance (b)
0.005"(0.125mm)
Min SMT Pad spacing (c)
0.004"(0.1mm)
Solder Mask Thickness
0.0007"(0.018mm)
Hole size
0.008"(0.20mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)
±0.003"(±0.0762mm)
Max PTH Aspect Ratio
10:1
Hole Registration
0.003"(0.075mm)
HASL
2.5um
Lead free HASL
2.5um
Immersion Gold
Nickel  3-7um  Au:1-3u''
OSP
0.2-0.5um
Panel Outline Tol (+/-)
±0.004''(±0.1mm)
Beveling
30°45°
V-cut
15° 30° 45° 60°
Surface finish
HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate
ROHS  ISO9001 TS16949  SGS  UL
Special requirements
Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger